Power Semiconductors Weekly
Power Semiconductors Weekly is a Marketing Psycho weekly podcast covering the latest news from power semiconductors industry. Delivered to you every Tuesday by Alexey Cherkasov, Power Semiconductors Weekly brings you the most interesting events in the world of power semiconductors and power electronics. Now you will never miss any major power semiconductors product release, technology update or market trends and news.
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- Vitesco Technologies And ROHM Have Signed a Long-Term SiC Supply Partnership
- Toyoda Gosei Develops Horizontal GaN Power Device of World-Class High-Voltage, High-Speed Operation
- Airbus and STMicroelectronics Collaborate on Power Electronics for Aircraft Electrification
- Toshiba Launches 600V Super Junction N-channel Power MOSFET Series with Ultra-Low RDS(on)
- Chinese SiC Power Device Provider AscenPower Mass Produces SiC Chips for Vehicle and Industrial Control
- Alpha and Omega Semiconductor Announces Logo Redesign that Reflects its Commitment to Developing Cutting-Edge Power Management Solutions
- Toshiba Releases 600V Super Junction Structure N-Channel Power MOSFET
- Mitsubishi Electric to Ship Samples of NX-type Full-SiC Power Semiconductor Modules for Industrial Equipment
- Infineon Releases Next Generation 1200 V CoolSiC™ Trench MOSFET in TO263-7 Package to Boosts e-Mobility
- Nexperia Launches E-mode GAN FETs for Low and High-voltage Applications
- SK Powertech Adopts Silvaco’s Victory TCAD Solution for the Development of NextGen SiC Power Devices
- Chinese Cities Back Compound Semiconductor Industry as Demand Grows
- GE Scientists Demonstrate Ultra-High Temperature SiC MOSFET Electronics
- Simulation Model of Industry’s First 1200 V GaN-on-Sapphire Device Released by Transphorm
- Nidec and Renesas Collaborate on Semiconductor Solutions for Next-Generation E-Axle for EVs
- GlobalFoundries and STMicroelectronics Finalize Agreement for New 300mm Semiconductor Manufacturing Facility in France
- STMicroelectronics and Sanan Optoelectronics to Advance Silicon Carbide Ecosystem in China
- Wolfspeed Webinar: Understanding Wolfspeed’s WolfPACK™ Power Module Family: Your Questions Answered!
- Mitsubishi Electric Develops SBD-embedded SiC-MOSFET with New Structure for Power Modules
- Navitas Initiates Strategic Manufacturing Investments
- Vitesco Technologies and onsemi Sign SiC Long-Term Supply Agreement and Agree to Invest In SiC Technology Capacity Expansion
- iDEAL Semiconductor Launches SuperQ™ Technology, Ushering in a New Era of Power Device Performance in Silicon
- Danfoss to Further Tap Green Biz Opportunities in China
- Magnachip Announces Plan to Separate Display and Power Businesses
- Semikron Danfoss Webinar: Silicon Carbide in AC Motor Drives
- Orbray and MIRISE Technologies Collaborate on Diamond Power Devices
- Analog Devices Announces Investment of €630 Million in Next Generation Semiconductor R&D and Manufacturing Facility in Limerick
- Coherent and Mitsubishi Electric Collaborate to Scale Manufacturing of SiC Power Electronics on 200 mm SiC Technology Platform
- onsemi and Sineng Electric Spearhead the Development of Sustainable Energy Applications
- Power Integrations’ New 3300 V IGBT Module Gate Driver Reports Telemetry Data for Observability, Predictive Maintenance and Lifetime Modelling
- Infineon to Hire More in Korea as Power Chip Demand Set to Surge
- Nexperia Webinar: Nexperia Power Rectifier. The Importance of Power Rectifier in Fast Switching Applications
- Mitsubishi Electric to Ship Samples of SBD-embedded SiC-MOSFET Module
- TI Helps Maximize EV Driving Range with SiC Gate Driver
- New Innovation Center to Provide AIXTRON with Expanded Capacities for R&D
- Power Integrations Unveils New SCALE-iFlex LT NTC IGBT/SiC Module Gate Drivers with Temperature Readout
- Penn State and onsemi Sign MOU to Boost Silicon Carbide Research in the U.S.
- Pioneering Interactive Datasheets from Nexperia put MOSFET Behavior Analysis at Engineers’ Fingertips
- onsemi Considers $2 billion Investment in EV Chip Production
- DENSO and USJC Announce Mass Production Shipment of Automotive IGBT
- Vishay Intertechnology Releases Gen 3 650 V SiC Schottky Diodes
- onsemi 1200 V EliteSiC M3S Devices Enhance Efficiency of EVs and Energy Infrastructure Applications
- Navitas Launches into High-Power Markets with GeneSiC SiCPAK™ Modules and Accelerates Bare-Die Sales
- Henkel Debuts Ultra-High Thermal Conductivity Pressure-Less Sintering Die Attach Adhesive
- Partnership for True Multiple Sourcing: Semikron Danfoss Power Modules with ROHM IGBTs
- Infineon and Hon Hai Technology Group (Foxconn) Sign MoU to Partner on SiC Collaboration
- Alpha and Omega Semiconductor Releases 600V 50mohm αMOS7™ Super Junction MOSFETs Family
- SPEC Developed an Advanced SiC Power Chip
- Magnachip Debuts New Family of 600V SJ MOSFET Products
- Wolfspeed and ZF to Open R&D Center in Nuremberg
- Infineon Diversifies Its Silicon Carbide Supplier Base
- Infineon Announces Supplier Agreement on Wafers and Boules with TanKeBlue
- Infineon Breaks Ground for New Plant in Dresden
- Infineon Introduces HybridPACK™ Drive G2
- Mitsubishi Electric to Ship Samples of HV100 Dual-type X-Series HVIGBT Modules
- onsemi and ZEEKR Sign Long-Term Supply Agreement for SiC Power Devices
- Infineon and SCHWEIZER Extend Cooperation in Chip Embedding to Develop More Efficient SiC Automotive Solutions
- Bosch Plans to Acquire U.S. Chipmaker TSI Semiconductors
- Toshiba Starts Construction of 300-milimeter Wafer Fabrication Facility for Power Semiconductors
- SMIC-Backed Chinese Contract Chip Maker Seeks to Raise US$1.4 billion on Shanghai’s Star Market
- Nexperia Releases 650V Silicon Carbide Diodes for Demanding Power Conversion Applications
- Microchip Technology Announces Promotion of Rich Simoncic to Executive Vice President
- Kyocera to Acquire Construction Site in Japan for New Smart Factory
- China Chip Event Draws Applied Materials and Others Despite U.S. Tensions
- Finepower Webinar-Series: “Brain Power 2023”
- ZF Signs Multi-Year Supply Agreement with STMicroelectronics
- CIL’s Advanced Semiconductor Packaging Facility Update
- SwissSEM Gets ISO 14001 and ISO 45001 Certifications for Its Production Site
- Leapers Semiconductor to Showcase SiC Power Portfolio during Fortronic in Bologna
- PowerUP Expo Returns in June
- DISCO Developed a Fully Automatic Dicing Saw Supporting φ8-inch Wafers
- Axcelis Announces Shipment of 500th Purion Ion Implanter
- EPC Presented Projected GaN Device Lifetime in Real World Applications
- Infineon Changes IPC to GIP
- Bosch Receives “Green Light” for Its $1 billion EV Parts Plant in Suzhou
- Toshiba Releases 150V N-channel Power MOSFET to Increase the Efficiency of Power Supplies
- DENSO Develops Its First SiC Inverter
- CISSOID & Silicon Mobility Expand Partnership
- onsemi Launches Simulation Tools
- Industrial-Grade SiC MOSFET from Diodes Incorporated Enables Higher Power Density
- China Becomes Top Holder of Ultra WBG Semiconductor Patents
- Breakthrough for High-Power Wireless EV Charging Technology
- SpeedVal Kit™ Ecosystem Simplifies Silicon Carbide Part Evaluation and Cuts Design Time
- Navitas Celebrates 75,000,000 GaN Power Shipments
- Infineon Teams With Infinitum to Drive Decarbonization
- Adoption of 800V in Mass-Market EVs to Boost Transition of Power Electronics to SiC
- Aehr Comments on Recent Tesla Statements on Silicon Carbide and Reiterates its Annual Guidance
- onsemi Celebrates Move of its Headquarters to LEED Gold-Certified Building on the Salt River Pima Maricopa Indian Community
- Nexperia Introduces the First Application-Specific MOSFETs (ASFETs) for Hotswap in SMD Copper-Clip LFPAK88 Packaging for 60% Reduced Footprint
- Infineon and Delta Electronics to Collaborate on Electromobility
- onsemi Honored with Supplier of the Year 2022 Award by Hyundai Motor Group
- Wolfspeed Hosts the First Stop on the Biden Administration’s ‘Invest in America’ Tour at its Durham HQ
- SEMIKRON Foundation and ECPE Honour the Team from Silicon Austria Labs with the Innovation Award 2023 while this Year’s Young Engineer Award Goes to Bo Yao
- Mr. Tsuneishi Takes Office as Outside Director of Resonac Holdings
- Wolfspeed and NC A&T to Establish Joint R&D Facility to Further Advance Silicon Carbide Innovation
- onsemi Develops IGBT FS7 Switch Platform with Leading Performance for Industrial Markets
- Qorvo® Delivers 5.4 mOhm 750V SiC FETs in TOLL Package for High Power Applications
- New MPLAB® SiC Power Simulator from Microchip Allows to Test SiC Power Solutions in Design Phase
- Power Integrations Launches 900 V GaN Flyback Switcher ICs
- Transphorm Releases 3 kW Inverter Board with Microchip’s Digital Signal Controller
- ROHM Establishes Ultra-High-Speed Control IC Technology that Maximizes the Performance of GaN Devices
- VisIC Technologies Demonstrates Efficient GaN 3-Phase Traction Inverter with Automotive-Grade PMSM Motor
- Mitsubishi Electric to Construct New Wafer Plant to Boost SiC Power Semiconductor Business
- Microchip Reaches Milestone in Initiative Aiming to Triple Semiconductor Production at its Oregon Facility
- South Korea to Build World’s Largest Semiconductor Cluster
- Fortronic Invites You to Bologna in April
- Resonac to Use Virtual Reality for Product Development
- SiC SBDs from ROHM Chosen by Murata Power Solutions for Data Center PSUs
- onsemi to Integrate its SiC Technology in BMW Group’s Next-Generation EVs
- Lawrence Livermore Chooses SemiQ’s SiC Diodes for Particle Accelerator Project
- Groundbreaking Ceremony Held for GWM Subsidiary’s Semiconductor Module Packaging & Testing Project
- Vincotech Webinar: Embedded Designs Drive Tomorrow’s Solutions
- Resonac Develops and Starts to Mass-produce Third Generation High-grade SiC Epitaxial Wafers
- Infineon to Acquire GaN Systems to Strengthen Its GaN Portfolio
- Sineng Electric and onsemi Cement Strategic Alliance with a Joint Laboratory for Sustainable Energy Applications
- McLaren Applied Selects STMicroelectronics to Supply Silicon Carbide Power Modules
- InventChip Closes Series B Financing Round
- Infineon Wide-Bandgap Developer Forum
- onsemi Announces New Chief Human Resources Officer
- Dongfeng’s SiC Modules to Be Mass Produced in 2023
- onsemi’s EliteSiC Family of Silicon Carbide (SiC) Technologies Enhance Performance of Ampt’s DC Optimizers
- Power Up Your Solar Performance
- Magnachip Introduces 8th-Gen 150V MXT MOSFET for Light Electric Vehicles
- onsemi Silicon Carbide Power Module for Traction Inverters Selected for Hyundai Motor Group’s High Performance Electric Vehicles
- Wolfspeed Appoints Stacy Smith to Board of Directors
- Silicon Carbide Semiconductor Supplier Selects Aehr FOX System for Wafer Level Test and Burn-in of Silicon Carbide Devices for Automotive Electric Vehicles
- CEA and Renault Develop Wide-Bandgap-Based Bidirectional On-Board Charger for EVs
- Renesas’ New Automotive Intelligent Power Device Enables Safe and Flexible Power Distribution in Next-Generation E/E Architectures
- ROHM’s 4th Generation SiC MOSFETs to be Used in Hitachi Astemo’s Inverters for Electric Vehicles
- Aehr Receives $25.1 Million Order for FOX-XP™ Test and Burn-in Systems to Support Production of Silicon Carbide Power Devices for Electric Vehicles
- ROHM Appoints Aly Mashaly as New Director Application and Technical Solution Center in Europe
- Toshiba Releases Intelligent Power Devices That Help Reduce Mounting Areas
- STMicroelectronics Reveals Scalable, Feature-Rich Automotive High-Side Drivers Leveraging Advanced Power Technology
- New N-channel Power MOSFETs Leverage Advanced Heat Dissipation Capabilities to Support Larger Automotive Currents
- Leapers Semiconductor Delivers Highest Power Density Ultra Compact SiC Power Modules on the Market
- PANJIT Introduces New High Voltage FRED for Various Power Systems
- Daxin Semi Sets up a 6-inch IGBT Production Line
- AdvanSiC Brings Together 11 Entities to Produce, Test and Validate Cost-Effective HV SiC MOSFETs
- PowerAmerica Annual Meeting
- Toshiba’s Lineup Expansion of 150 V N-Channel MOSFETs
- Microchip Plans to Invest $880 Million to Expand its SiC and Si Capacity in Colorado
- Infineon Kicks off New Fab in Dresden
- Texas Instruments Selects Utah for its Next 300-mm Semiconductor Wafer Fab
- Amkor Technology and GlobalFoundries to Provide At-scale Semiconductor Test and Assembly Services in Europe
- ECPE SiC & GaN User Forum: Potential of Wide Bandgap Semiconductors in Power Electronic Applications
- Infineon QDPAK and DDPAK Packages Registered as JEDEC Standard for High-Power Applications
- Polar Semiconductor Investment and Expansion
- Pan-European Research Initiative PowerizeD for Intelligent Power Electronics Launched
- 20 Years of LFPAK Technology
- PCIM Asia Conference 2023 Call for Papers Open
- PowerAmerica Webinar: Bidirectional SiC and GaN Switch Technology
- Diodes Incorporated Releases Its First Silicon Carbide Schottky Barrier Diodes
- NexGen Announces Production Availability of World’s First 700V and 1200V Vertical GaN Semiconductors
- Wolfspeed Announces Plan to Construct World’s Largest, Most Advanced SiC Facility in Germany
- Wolfspeed and ZF Announce Partnership for Future Silicon Carbide Semiconductor Devices
- Veeco Acquires Epiluvac AB to Accelerate Penetration into High Growth SiC Epitaxy Equipment Market
- CGD Webinar: Powering up the Future with GaN
- Renesas Introduces New Gate Driver IC for IGBTs and SiC MOSFETs Driving EV Inverters
- Ideal Power Launches Its SymCool™ Power Module
- Navitas and KATEK Accelerate Solar Adoption
- Chemnitz University of Technology Achieved Progress in Improving Reliability and Robustness of Power Semiconductors
- Filtronic’s Automating Wedge Bonding for Complex Wire Components
- Wolfspeed Officially Names Its Siler City Facility
- New All-in-One Hybrid Power Drive Module Solution from Microchip
- AIST Demonstrates World’s First Hybrid Transistor Integrating GaN and SiC
- Bosch to Invest Over $1 billion in E-mobility Capacities in China
- Wolfspeed Plans a Chip Factory in Germany
- Haviv Ilan to Become Next President and CEO of Texas Instruments
- Semikron Danfoss Webinar: Benefits of Schottky Barrier Diodes
- New STPOWER Devices from STMicroelectronics
- Resonac and Infineon Technologies Strengthen Cooperation in SiC Materials for Power Semiconductors
- Infineon Technologies Increases Focus and Investment into Core Semiconductor Development
- CVD Equipment Receives Additional Order for PVT-150 Systems for SiC Growth
- Arizona State University Developing Transistors Made of Diamond and Boron Nitride
- IDTechEx Webinar: The Evolution of EV Thermal Management and What’s Beyond 2022?
- Leapers Semiconductor Releases Compact Three-Phase SiC Power Module for EV Air Compressor
- onsemi Introduced EliteSiC Silicon Carbide Family Solutions
- Wolfspeed to Power Future Mercedes-Benz EV Platforms
- Aehr Reports 54% Revenue Growth on Strength of Semiconductor Test and Burn-In Sales for EVs
- Infineon’s CEO Notes Lack of Power Semiconductor Investment
- Wolfspeed Webinar: The Industry’s Most Versatile Modular Evaluation Platform is the Starting Point for All Silicon Carbide Designs
- DISCO Developed Two Types of Grinding Wheels for Si and SiC Wafers
- DFG8541: DISCO’s Newly Developed Fully Automatic Grinder
- European Collaborative Project Power2Power Successfully Completed
- TI’s Latest 300-millimeter Wafer Fab in Lehi, Utah, Begins Production
- Geely Chip Affiliate Wraps Up First Fundraiser
- Nexperia Calls in the Lawyers to Save Welsh Chip Fab Deal
- AMP’s Innovative Electric Vehicle Charging Solutions Utilize Wolfspeed’s E-Series Silicon Carbide Devices
- Renesas Announces New Sales Organizational Structure and Executive Personnel Changes to Drive Next Phase of Growth
- onsemi joins Arrow McLaren SP as a Primary Partner of No. 6 IndyCar piloted by Felix Rosenqvist
- Nexperia Invests in Sustainable Alternatives to Batteries
- CGD and Neways Sign GaN-based Clean Energy Deal at Electronica 2022
- Navitas Semiconductor and Avnet Silica Announce Agreement for Close Collaboration to Expand Market for Advanced GaN Power ICs
- Top-side Cooling Simplifies Design and Reduces Cost for Compact Power Solutions
- South Korea, Netherlands Agree to Expand Chip Cooperation
- Third Generation BM3 Silicon Carbide Power Modules Boost Railcar Power System Designs
- onsemi Silicon Carbide Technology Enables All-Electric VISION EQXX to Go Further on a Single Charge
- The Transistor of 2047: Expert Predictions. What will the Device be Like on Its 100th Anniversary?
- Vishay Intertechnology’s New MOSFET and Diode Power Modules in EMIPAK 1B Offer a Complete Solution for On-Board Charging Applications
- Energy-Saving Technology and Carbon Neutrality on High-Speed Railways
- Global Chip Industry Projected to Invest More Than $500 Billion in New Factories by 2024
- Germany and Europe: Semiconductor Industry to Be Strengthened
- onsemi Awards More Than $796k in Grants to 39 Organizations Globally during Fall 2022 Cycle
- STMicroelectronics Boosts EV Performance and Driving Range with New SiC Power Modules
- Semikron Danfoss eMPack® Chosen for Dana’s Silicon-Carbide Inverter Development
- Coherent Partners with ETRI and KAIST to Focus on Advanced Semiconductor Devices for the Korean Market
- LA Semiconductor Purchases Fabrication Plant From onsemi
- Toshiba to Expand Power Semiconductor Production Capacity with New Production Facility
- Hunan Sanan Secures Order for $524 Million from a Leading NEV Brand
- Applied Materials to Extend Global Leadership in Semiconductor Manufacturing Technology
- Supervisory Board Appoints Dr. Michael Heckmeier as Future CEO Of Siltronic AG
- Leapers Semiconductor Expands Its E0 Family of SiC Power Modules
- Mitsubishi Electric to Launch “SLIMDIP-Z” Power Semiconductor Module
- Torex Semiconductor to Collaborate with YES POWERTECHNIX
- Wolfspeed Expands and Extends SiC Wafer Supply Agreement
- Monolithic Power Systems Signs Agreement with Vanguard International to Secure Semiconductor Supply
- EPC and VIS Announce Joint Collaboration on 8-inch Gallium Nitride Power Semiconductor Manufacturing
- Vishay Presents Three Phase Bridge Power Modules in the Compact MTC Package
- Toshiba Develops SiC MOSFET with Embedded Schottky Barrier Diode
- Vincotech Updates MiniSkiiP® Product Line
- Soitec Breaks Ground on Singapore Fab Extension
- Yole Webinar: Semiconductor Trends in Automotive
- NexGen Power Systems Webinar: NexGen Vertical GaN™ Deep Dive: The Future of Power Semiconductors
- STMicroelectronics and Soitec Cooperate on SiC Substrate Manufacturing Technology
- Transphorm Expands Footprint with GaN Application Lab in China
- Jaguar TCS Racing Reveal I-TYPE 6 – The Most Advanced All-Electric Jaguar Race Car Ever
- ROHM and BASiC Semiconductor Form a Strategic Partnership
- Purdue University and GlobalFoundries Partner to Strengthen Research and Development, Semiconductor Education
- Wolfspeed Webinar: Virtual Seminar 2022
- Infineon New Modules for 352 kW PV String Inverter
- ROHM, Mazda, and Imasen Sign a Joint Agreement to Develop Inverters
- Call for Proposals for SEMIKRON Innovation Award and SEMIKRON Young Engineer Award
- BYD Scraps Spin-off of Chip Unit
- Unikorn Announces Joining of the Taiwan Talent Sustainability Action Alliance
- Wolfspeed Webinar: Design and Implementation of Future EV
- Infineon to Invest €5 billion in a New Fab in Dresden
- BorgWarner to Invest $500 Million in Wolfspeed
- Infineon and Stellantis Agree on Silicon Carbide Chips
- Nexperia is Shocked by the Secretary of State’s Order to Divest Newport Wafer Fab
- Wide-Bandgap Power at Silicon Cost
- GaN Systems Unveils Annual Power Semiconductor Predictions for 2023
- Leapers Semiconductor Opens a New SiC Fab to Correspond to Market Challenges
- Alpha and Omega Semiconductor Announces New 650V and 750V Automotive Qualified αSiC MOSFETs
- Leapers Semiconductor Expands Its E0 Series SiC Power Modules Product Line
- NXP Joins Semiconductor Climate Consortium
- Photonic, Power Electronics & RF Packaging Forum
- GE Shows 3.8kV SiC Diode
- Vishay Intertechnology FRED Pt® Gen 5 600 V Hyperfast Rectifiers in Isolated Package Deliver Best in Class Reverse Recovery Performance
- onsemi Launches Automotive Silicon Carbide-Based Power Module Trio for On-Board Chargers
- Infineon Introduces The 950 V CoolMOS™ PFD7 Family with an Integrated Fast Body Diode to Address High-Power Lighting and Industrial SMPS Applications
- Toshiba GaN Power Device Balances Performance and Ease of Use
- Vishay Intertechnology 600 V EF Series Fast Body Diode MOSFET in Low Profile PowerPAK® 10 x 12 Package Delivers Industry’s Lowest RDS(ON)*Qg FOM
- Saki Corporation Launches Upgraded X-Ray Inspection System for Power Modules
- Qorvo® and SK Siltron CSS Announce Long-Term Silicon Carbide (SiC) Supply Agreement
- Navitas and VREMT Open Joint R&D Lab for Next-Gen EV Power Systems and Semiconductors
- Transphorm Appoints Six Company Leaders
- Next-generation GaN E-mobility Technology. KYOCERA AVX Salzburg and VisIC Technologies Expand Their Collaboration
- Jaguar Land Rover Partners with Wolfspeed for Silicon Carbide Semiconductor Technology Supply for Next Generation Electric Vehicles
- European Investment Bank Supports Development of Siltronic’s Next Generation of Silicon Wafers
- Great Wall Motor to Set Up Chip-making Unit
- $30 Million in Federal Funding to Advance Innovation and Production of Next-Generation GaN Chips at GlobalFoundries Fab in Vermont
- Navitas’ EVP Ranbir Singh, Silicon Carbide Pioneer, Inducted into Engineering Hall of Fame
- Geely Technology Group Sets Up Joint Lab with CR Micro for Automotive Power Semiconductor
- flowPIM® S3 + 3xPFC for Power Ranges up to 11 kW
- Infineon Expanding Production of High-power Semiconductor Modules
- STMicroelectronics to Build Integrated Silicon Carbide Substrate Manufacturing Facility in Italy
- TI’s New 300-millimeter Wafer Fab in Richardson, Texas, Begins Initial Production
- onsemi Expands Operations in Bucharest with Opening of New Design Center
- SwissSEM Opens Test-Laboratory in Switzerland
- onsemi Expands its Silicon Carbide Fab in the Czech Republic
- onsemi to sell 200mm Wafer Fab to Japanese and US Foundries Under New Strategic Focus
- Odyssey Semiconductor Achieves 1200 Volt Rating on Vertical GaN Power Devices
- New Vishay Intertechnology FRED Pt® Gen 5 Hyperfast and Ultrafast Rectifiers
- First Aluminum Nitride Crystal with 43 mm Diameter
- SK Siltron to Form JV to Develop SiC and GaN Chips
- EPC Opens New Motor Drive Center of Excellence
- Third Generation 1200V SiC MOSFETs from Toshiba
- Wolfspeed Selects North Carolina for World’s Largest SiC Materials Facility
- II-VI Changes Name to Coherent and Launches New Brand Identity
- Showa Denko Starts to Ship Samples of 200mm SiC Epi-wafers
- Showa Denko Group Doubles the Site of Storage Facility for Semiconductor Processing High-Purity Gas in South Korea
- PCIM Asia 2022 to Be Moved to October with Major Brands and Concurrent Events Confirmed
- Next Generation Uninterruptible Power Supplies with SiC Solutions from Leapers Semiconductor
- Renesas Unveils New-Generation Si IGBTs for Electric Vehicle Inverters
- Toshiba Launches Third Generation 650V SiC MOSFETs
- SK Siltron CSS Opens a New Fab in Gumi
- Marelli Motorsport and Politecnico di Torino Cooperate on GaN
- Wolfspeed Webinar: Build More Efficient Solar Inverters and Energy Storage Systems with SiC
- Bosch is Gunning for a Bigger Slice of the Automotive Semiconductor Business
- Toshiba Releases 2.5A Output Smart Gate Driver Photocoupler for IGBT and MOSFET Control and Power Protection in Industrial Applications
- Vincotech’s New Three-level NPC Module
- Exploring Automated Single-Wafer Ashing of Compound Semiconductors
- Technology and Cost Comparison of Seven Automotive Power Modules from: Hitachi, StarPower, Vitesco Technologies, STMicroelectronics, Denso, and Wolfspeed
- Warwick University Commissions New ESPEC Test Chamber
- New Vishay FRED Pt® Gen 5 600 V Ultrafast Rectifiers in TO-244 Package
- Infineon Expands Supplier Base for SiC Wafers with II-VI
- Green Light for Semikron Danfoss
- Li Auto to Develop SiC Power Modules
- SK Siltron to Complete New Wafer Fab in US Next Month
- Japan’s Startup Flosfia to Produce Power Semiconductors That Increase EV Range
- Bourns Enters IGBT Market
- Navitas to Buy GeneSiC
- Vishay to Expand Production in Germany
- Ferrotec Breaks Ground at New Malaysia Factory
- Hyundai to Produce Their Own Semiconductors
- II-VI Closes $100 Million Contract to Supply Tianyu with SiC Substrates
- Henkel and CITC Forge Partnership to Accelerate High-Thermal Die Attach Solutions
- Traction Inverters Go GaN
- onsemi Celebrates Expansion of SiC Production in New Hampshire
- Vishay Receives R&D Grant for WATT4FRED Project
- Demand for Chips is Collapsing Just as Biden Signs CHIPS and Science Act
- Join Power Semiconductor Executive Summit in Munich
- Leapers Semiconductor High Power Density SiC Modules Target Solar Application
- SEMIKRON under Attack
- Welcome to Bodo’s Wide Bandgap Event
- Wolfspeed Webinar: Optimizing Drive Cycle Simulations for Automotive Applications
- onsemi Power Webinars Series
- Toshiba’s New SiC MOSFETs Delivers Low On-Resistance and Significantly Reduced Switching Loss
- UnitedSiC (now Qorvo®) Extends Highest Performance, Most Efficient 750V SiC FET Portfolio for Power Designs
- flowBOOST Dual and Triple Boosters for 1500 V Solar Inverters
- LPE and A*Star’s Institute of Microelectronics to Develop High Quality 200mm SiC and Specialty Epitaxy Processes
- Japan’s Denso Pushes EV Efficiency with New Power Semiconductors
- Infineon Webinar: Hybrid and Electric Solutions for Commercial Vehicles
- 3 Ways Semiconductors Enhance Automation and Efficiency
- onsemi Receives Recognition for Third Straight Year
- Renesas Partners with Tata to Accelerate Progress in Advanced Electronics for India and Emerging Markets
- Research Facility to Help UK Take the Lead in Semi R&D
- BorgWarner Plans Poland Power Electronics Tech Centre
- ABB and CERN Partner to Study Electric Motor Energy Savings
- Marelli Presents Its New 800 Volt Silicon Carbide Inverters Platform at Dritev
- Automotive SiC Power Component Market to Grow to $1bn in 2022 then $3.94bn by 2026
- STMicroelectronics Hosts French “Electronique 2030” Program Launch at its Crolles Site
- SwissSEM Reveals Next Products
- WIN Semiconductors Introduces 0.12 µm RF GaN on SiC Technology
- Rad Hard GaN Transistors Offering Highest Density and Efficiency on the Market for Demanding Space Applications Available from EPC
- University of Catania and STMicroelectronics Launch a New Advanced Master’s Program in Power Electronics Devices and Technologies
- Japan’s Renesas CEO Says No Plans to Build Chip Production Facilities in U.S.
- The Best Semiconductor of Them All?
- South Korea Targets 340 trillion Won Investment for Chip Supremacy
- How China Became Ground Zero for the Auto Chip Shortage
- Silicon 100: Startups to Follow in 2022
- Electric Cars as Buffer Storage for Solar Power: Infineon and Delta Enable Bidirectional Charging at Home
- GlobalFoundries Statement on U.S. House of Representatives’ Passage of Legislation to Increase U.S. Semiconductor Manufacturing
- Bosch Invests Further Billions in Chip Business
- onsemi to Invest $1 Billion in Gyeonggi Research Center
- Silicon Carbide Cooperation between SEMIKRON and ROHM Semiconductor
- Soitec Boosts Customer Yield of SiC Manufacturing with KLA Inspection Technology
- IMEC to Help Set Up Semiconductor Units in India
- Talk to the Experts at Bodo’s Wide Bandgap Talk
- PSMA PTR Webinar: SiC Power Technology Status and Barriers to Overcome
- Toshiba Announced Availability of Highly Accurate SPICE Models
- GlobalWafers Selects Sherman, Texas for New Semiconductor Silicon Wafer Site
- Navitas Acquires VDD Tech to Expand High-Power, Next-Gen Semiconductor Capabilities
- STMicroelectronics and GlobalFoundries to advance FD-SOI ecosystem with new 300mm manufacturing facility in France
- GaN Webinar Series by EPC
- Infineon Webinar: High-Power Semiconductor Solutions for Green Hydrogen Electrolyzer Applications
- SEMIKRON Webinar: Power Module Reliability: Humidity
- Infineon and Delta Electronics Strengthen Collaboration in WBG-based Server and Gaming PC Power Solutions
- Toshiba Launches Fast Recovery Diode Housed in a Press-Pack Package
- Temperature-Resistant Power Semiconductors 3D Printed by Chemnitz University of Technology
- SK Siltron Leads Domestic SiC Power Semiconductor Production
- Japan’s Greatest Chipmakers from Toshiba to Sony Brace for Engineer Scarcity
- Infineon Webinar: Driving 100 km on 10 kWh? It’s All About Efficiency!
- Leapers Semiconductor Introduces New Package SiC Power Module
- DB HiTek Builds 8-inch SiC Semiconductor Production Line
- Wise-integration Launches Most-Compact Gallium Nitride Half-Bridge Power IC
- Wolfspeed Power Applications Forum
- EPE 2022 ECCE Europe is on Its Way
- The MOSIS Service of USC Information Sciences Institute and WIN Semiconductors Corp to Collaborate on III-V Compound Semiconductor Manufacturing
- DENSO, Honeywell Co-Develop E-Motor for Lilium’s All-Electric Jet
- Renesas Introduces Complex Device Driver Software to Ease Development of Battery Management Systems for Electric Vehicles
- BorgWarner’s Silicon Carbide Inverter Powers Two Performance Car Brands to Win in Range
- Korea’s LX Group Seeks to Acquire Magnachip Semiconductor
- II-VI Incorporated Significantly Reduces Its Global Carbon Footprint with Renewable Energy Contracts in Asia
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- Advantest Acquires CREA
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- Yole Développement and System Plus Consulting Combine their Expertise to Become Yole Group
- PowerUP EXPO 2022
- SEMIKRON Webinar: SEMITRANS 20 – High Power, Higher Reliability
- ENPOWER First to Adopt Infineon’s Latest 750 V Discrete IGBTs
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- Magnachip Introduces a New 40V MOSFET to Control BLDC Motors for Automotive Applications
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- PM Modi to Inaugurate First Semicon India Conference
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- TankeBlue Semiconductor to Raise Funds through IPO
- Navitas Semiconductor at 2022 International Conference on Compound Semiconductor Manufacturing Technology
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- Leapers Semiconductor to Introduce HPD Series SiC MOSFET Power Modules for Automotive Application
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- BorgWarner Receives U.S. Department of Energy Award for DC Fast Charger
- Infineon to Expand Existing Backend Operations in Indonesia
- SEMICON Southeast Asia 2022 to Focus on Semiconductor Supply Chain Sustainability and Resilience
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- ASM Unveils Expansion in Singapore to Meet Global Demand for Advanced Semiconductors
- Hyundai Motor Group Honors Infineon for Supply Competence and Strategic Cooperation
- Shenzhen Stock Exchange Suspends IPO Review of BYD Semiconductor
- Power&Beyond Web Conference: High Performance GaN Devices for High Volume Applications
- Yole Développement Webcast: SiC Evolution. Cars Drive a Multi-billion Dollar Business
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- Odyssey Semiconductor Announces Technology Development Milestones
- Showa Denko Launches Mass Production of 6-inch SiC Single Crystal Wafers
- SEMIKRON and Danfoss Silicon Power Join Forces
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- SEMIKRON Webinar: Power Module Reliability – Power Cycling
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- Infineon Presents Optimized CoolSiC™ MOSFETs 650 V in D²PAK
- Microchip Unveils Industry-Leading 3.3 kV Silicon Carbide Power Devices
- ROHM Starts Production of 150V GaN HEMTs
- New SBD & MOSFET Packages from Wolfspeed Slash Size, Increase Power Density
- NXP and Hitachi Energy Collaborate on Power Module to Accelerate Silicon Carbide Adoption in E-mobility
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- Power Integrations Unveils New Office Facility in Switzerland
- GE announces Digi-Key as Channel Partner for Silicon Carbide Power Modules
- Toyoda Gosei Succeeds in Making Larger GaN Substrates for Next-Generation Power Devices
- SK Siltron to Spend $845 million on New 300mm Wafer Plant
- SEMIKRON Foundation and ECPE Honour Awards
- Wolfspeed Adds to Global Operations Leadership Team to Support Rapid Company Growth
- Infineon’s Industrial Wide-Bandgap Developer Forum
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- Lucid Air – EV AC Charging ‘Powered By ROHM’
- Alpha and Omega Semiconductor Releases 600V Super Junction MOSFETs
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- Infineon’s IPOSIM Now Offers Lifetime Estimation Simulations
- Soitec to Expand its Manufacturing Footprint in Bernin with SiC
- II-VI Incorporated Accelerates Investment in Silicon Carbide Substrate and Epitaxial Wafer Manufacturing
- Infineon Webinar: Automated Lifetime Estimation of Power Semiconductors
- Infineon Presents New Automotive 750 V EDT2 IGBTs
- Toshiba’s New Generation Super Junction Power MOSFET “DTMOSVI Series”
- FormFactor Introduces High-Power Semiconductor Wafer Probing System
- InventChip Sets Up Strategic Fund Solely Invested by EV Maker Xiaopeng
- EIB Releases €600 million Loan to STMicroelectronics
- onsemi Divests Wafer Manufacturing Sites as Part of Fab-Liter Strategy
- GaN Power Devices and Applications
- Infineon presents EiceDRIVER™ F3 Enhanced
- Vishay Intertechnology Introduced 600 V E Series MOSFETs
- Transphorm to Demonstrate 99% Efficiency Power Switching with a 1200 Volt GaN Power Transistor
- Bosch to Invest on Extending Semiconductor Production in Reutlingen
- Dr. John Palmour Elected to the National Academy of Engineering
- Vishay Intertechnology Announces CEO Retirement and Succession Plan
- Taiwan Semiconductor Webinar: Rectifier Diode Technology Evolution
- Mitsubishi Electric to Launch “SLIMDIP-X” Power Semiconductor Module
- Cambridge GaN Devices to Develop GaN Power Transistors and ICs
- GlobalWafers Italian Subsidiary Launches 300mm Expansion Plan
- Infineon Invests €2 billion In a New Malaysia Frontend Fab
- SEMIKRON Secures Billion Euro Contract with German Automotive Manufacturer
- PowerAmerica’s Annual Meeting 2022
- Wolfspeed Webinar: Silicon Carbide Solutions for Energy Storage Systems
- Mitsubishi Electric to Launch Half-Bridge Driver HVIC with BSD Function
- Vishay Intertechnology N-Channel MOSFETs Deliver Best in Class RDS(ON)
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- European Chips Act
- Toshiba Group Technology Strategy
- GlobalWafers Capacity Expansion
- Nexperia – Five Years of Independence
- Dual Gate Drivers Optimize and Simplify SiC and IGBT Switching Circuits
- Power Integrations Introduces High-Voltage Switcher ICs with 1700 V SiC MOSFET
- II-VI Qualifies 1200 V SiC MOSFET Platform to Automotive Standards and Expands Relationship with GE
- STMicroelectronics to Double Investments to Meet High Chip Demand
- Toshiba to Expand Power Semiconductor Production Capacity with 300-millimeter Wafer Fabrication Facility
- Wolfspeed Webinar: Silicon Carbide Discrete MOSFETs Push Higher Power in EV Fast Charging
- Toshiba Launched New 1200/1700 V Silicon Carbide MOSFET Modules
- Fuji Electric Makes an Investment in Production of SiC Power Semiconductors
- IVWorks Acquires Saint-Gabain’s GaN Wafer Business
- Wolfspeed Is to Open a Tech Hub in Belfast
- GAC and CRRC Times Electric Set Up Qinglin Semiconductor
- SEMIKRON Webinar: Increase Development Speed with SEMIKRON Application Samples
- Magnachip Launches New Generation of High-Voltage 600V SJ MOSFETs
- USI Plans to Mass-Produce IGBT and SiC Power Modules for Electric Vehicle Inverters in 2022
- Toshiba Established a New High Voltage Laboratory in Germany
- Mitsubishi Electric to Expand Power Semiconductors Production
- WeEn Semiconductors Launches Global Operation Center in Shanghai
- Join Bodo’s WBG Expert Talk
- Wolfspeed Webinar: Silicon Carbide Scale and Scalability Enabling Fast DC Charging
- Toshiba Expands Power MOSFETs Lineup
- VINcoNPC X12 Engineered to Up Power & Efficiency
- Infineon’s New OptiMOS™ Power MOSFET
- SkyWater and Applied Novel Devices Enable Breakthrough with New Class of Silicon Power MOSFET
- A*STAR’s Institute of Microelectronics and Soitec to Develop Next-Generation Silicon Carbide Semiconductors
- TANAKA Denshi Kogyo to Strengthen Its Capacity of Aluminum Bonding Wires for Power Semiconductors
- Diodes Incorporated and Sentec Set Up DiodSent JV
- Bodo’s Wide Bandgap Event
- PowerUP Expo
- Ruttonsha International Rectifier to Buy Visicon Power
- Status of the Power Electronics Industry 2021
- Status of the Power Module Packaging Industry 2021
- SiC Transistor Comparison 2021
- ExpoElectronica 2022 is Scheduled for April
- BYD Launches 1,200 V Power Device Driver Chip
- Wuxi Leapers Semiconductor Launches E0 Series SiC Power Module
- hofer powertrain and VisIC Technologies Develop 3-Level 800V GaN Inverter
- LX Semicon Acquires LG Innotek SiC Asset
- BYD Starts Buying IGBT Modules from Other Suppliers
- Marching-Power Technology Closes 500 million Yuan Series C Round GaN Chipmaker
- CorEnergy Semiconductor Completes Series C Financing to Expand Production
- Update on ROHM Solution Simulator: New Thermal Analysis Function
- STMicroelectronics Introduces First PowerGaN Products
- alpitronic Selects Infineon’s Easypack™ Coolsic™ Modules and Eicedriver™ X3 Drivers for Its 50 kw Hypercharger
- Nexperia Uses AIXTRON Equipment as It Enters the SiC Market
- Wuxi Leapers Semiconductor Co., Ltd. Completed 100 million yuan of A-Round Financing
- STMicroelectronics and Politecnico di Milano Expand Semiconductor R&D Infrastructure
- AspenCore Releases Guide to Silicon Carbide: Enabling a Smart Energy Future
- onsemi Launches High-Performance, Low Power-Loss SUPERFET V Family of MOSFETs
- Toshiba’s New Press Pack IEGT Contributes to Size Reduction and Higher Efficiency of Industrial Equipment
- STMicroelectronics Releases New Silicon-Carbide Devices
- CISSOID & Silicon Mobility Announce a Partnership on SiC Inverters for Electric Vehicles
- Microchip to Provide SiC MOSFETs and Digital Gate Drivers for Mersen’s SiC Power Stack Reference Design
- Bosch Gives Go-Ahead for Volume Production of Silicon Carbide Chips
- onsemi Webinar: How SiC is Shifting the Future of EV
- Deeper Integration at Higher Power
- Alpha and Omega Semiconductor Releases 600V Low Ohmic and Fast Body Diode αMOS5™ Super Junction MOSFETs Family
- Vitesco Technologies Enters into Strategic Partnership with GaN Systems Alongside a Minority Investment
- Soitec Acquires NOVASiC and Announces Strategic Partnership with Mersen to Develop New Silicon Carbide Substrates
- A*STAR’s Institute of Microelectronics and STMicroelectronics Team Up on SiC R&D for the EV Market and Industrial Applications
- BorgWarner Suzhou Celebrates Phase II Ground Breaking, Enhancing R&D and Production Capabilities
- WeEn Technology Answers the Call for Higher Efficiency
- Toshiba Integrates a High-performance Driver IC for Controlling Next-generation Power Semiconductors into a Single Chip
- GaN Systems and USI Form Strategic Partnership to Accelerate GaN Adoption in Electric Vehicles
- Aehr Test Systems Joins PowerAmerica Institute to Support Advancing SiC and GaN Technologies
- WIN Semiconductors and NYCU Established a Joint Technology Innovation Center
- Supervisory Board Appoints Jochen Hanebeck as Successor to Dr. Reinhard Ploss as CEO of Infineon
- PowerUP EXPO 2021
- Microchip Webinar: Applications of Silicon Carbide in Vehicle Electrification
- Alpha and Omega Semiconductor Introduces 80V Power MOSFET
- Fuji Electric Launches the 2nd-Generation Discrete SiC-SBD Series
- Infineon Significantly Improves Technology with OptiMOS™ 6 100 V
- ROHM Recognized as a Preferred Supplier of SiC Power Solutions by UAES
- Texas Instruments to Build New 300-mm Semiconductor Wafer Fabrication Plants
- DuPont Announced Acquisition of Rogers Corporation
- Semikron Webinar: Reduced Thermal Resistance with Latest Phase Change TIM
- Nexperia Introduced High-Performance Silicon Carbide Diodes
- Diodes Incorporated Target EV Applications with New High Current Rated TOLL MOSFETs
- Bosch to Create European Supply Chain for Silicon Carbide Semiconductors
- Geely to Begin Mass-Production of Its Silicon Carbide Power Modules
- II-VI Incorporated to Supply Silicon Carbide Substrates for Power Electronics
- Toshiba Announced Strategic Reorganization
- SemiQ Launches New 1200V SiC MOSFET
- DENSO Provides SiC Power Semiconductors
- Semiconductor Power Electronics Center Developed a Novel and Cost-Effective 3.6kV/400A SiC HB IPM Based on the Austin SuperMOS
- BorgWarner Receives U.S. Department of Energy Award for High Power-Dense Inverter
- KEC Invests 20 billion Won to Take the ‘Second Leap’
- Qorvo® Acquires United Silicon Carbide (UnitedSiC)
- Vincotech’s flowANPFC and flow3xANPFC for More Efficient DC EV Charging
- B-TRAN™ will be Evaluated Against IGBTs and SiC Power Devices
- Zhenghai Group and ROHM to Establish a Joint Venture in SiC Power Module Business
- Bosch to Invest More Than 400 Million Euros in Its Semiconductor Fabs in 2022
- Siltronic Breaks Ground for a New Fab in Singapore
- SK Hynix to Acquire Local Chip Contract Manufacturer for $492 Million
- Bodo’s Wide Bandgap Event Goes Online on November 30
- Wolfspeed and ZINSIGHT Enhance Efficiency with Silicon Carbide
- centrotherm to Cooperate with TRANSFORM
- Littelfuse to Acquire Carling Technologies
- Transphorm Appoints Cindi Moreland to Board of Directors
- PINK Webinar: Sintering Basics and the Benefits of PINK Sintering Systems
- STMicroelectronics New MDmesh™ K6 800V STPOWER MOSFETs
- ROHM’s Latest Generation of Dual MOSFETs
- Epitaxy Equipment Market Trends
- Infineon and EBV Elektronik Webinar: High Power UPS with CoolSiC™
- Semikron Webinar: Gate Driver Principles, Considerations and Selection Process
- New Infineon EasyPACK™ 2B EDT2 Power Module
- New Way of Detecting Transistor Defects
- $18M NSF Grant to Build National Semiconductor Fabrication Facility
- General Motors and Wolfspeed Forge Strategic Supplier Agreement
- Navitas Shenzhen Expands 300% to Support Extraordinary China Revenue Growth and Accelerate High-Power GaN Applications
- Toshiba’s New Simulation Technology Shortens Verification Times for Automotive Semiconductors by about 90%
- High-Voltage GaN-on-Silicon HEMT Reaches 300mm
- Showa Denko Concludes Long-Term Contract to Supply SiC Epitaxial Wafers for Toshiba
- SUMCO Announced Issuance of New Shares to Support Production of Silicon Wafers
- II-VI Incorporated Wins Excellent Partner Awards from Sumitomo
- Keysight Technologies, National Central University Optical Sciences Center, Establish Third-generation Semiconductor R&D and Test Open Laboratory
- Automotive Semiconductor Trends 2021
- VINcoSIM – New Online Simulation Environment from Vincotech
- UnitedSiC Announced Industry-Best 6mohm SiC FET
- GaN Systems Signed Semiconductor Capacity Agreement with BMW
- Cree | Wolfspeed to Transfer to the New York Stock Exchange
- Grand Capping Ceremony of Ferrotec（Jiangsu）Power Semiconductor Research Institute
- Silicon MOSFET Market and Technology Trends 2021
- International Conference on Integrated Power Electronics Systems and Solutions
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- Showa Denko Concludes Long-Term Contract to Supply SiC Epitaxial Wafers for ROHM
- Global Fab Equipment Spending Forecast to Reach $100B in 2022
- Hangzhou Semiconductor Wafer Has Successfully Completed Financing
- Vincotech Webinar: Design Challenges and Solutions for 1,500 V PV Inverter Systems
- Infineon Webinar: Power Semiconductor Solutions for Propulsion and Auxiliaries in Trucks, Delivery Vehicles and Buses
- Infineon Enhances 1200 V EconoDUAL™ 3 Portfolio with IGBT7 Featuring New Current Ratings
- Power Integrations Introduces New SCALE-iFlex Gate Drivers
- New Applied Materials Technologies Help Silicon Carbide Chipmakers Accelerate the Transition to 200mm Wafers
- BYD Semiconductor Moves Forward
- Infineon Celebrates the Official Start of Production in Their Brand New 300-Millimeter Wafer Chip Factory
- Nexperia Launches ‘Power Live’ Virtual Conference
- Semikron Webinar: Efficient Green Hydrogen Production with Power Electronic Stacks
- Infineon and Panasonic Accelerate GaN Technology Development for 650 V GaN Power Devices
- SMIC to Build $8.87bn Shanghai Chip Plant in Challenge to TSMC
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- Hongwei Technology Power Semiconductors Company Went Public
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- Heraeus Electronics at PCIM Asia 2021
- Avnet Silica Webinars: Power Solutions for Vehicles and Fast Charger Applications
- Japan’s Fuji Electric Gives $360m Boost to Power Chip Business
- onsemi to Acquire GT Advanced Technologies
- VisIC Technologies Raises $35M, in a Round Led by GoldenSand Capital
- ROHM Celebrates Its 50th Anniversary in Europe: Focus on Power and Analog Solutions
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- Pump up the Power of Your 1500 V PV Inverters with flowANPC S3 split
- Cree | Wolfspeed and STMicroelectronics Expand Existing 150mm Silicon Carbide Wafer Supply Agreement
- Star Semiconductor Intends to Raise 3.5 Billion Yuan for a Number of Power Device Expansion Projects
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- Austrian Research Project “H2Pioneer“: Green Hydrogen for the Semiconductor Industry
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- Keysight Launches Scienlab Battery Pack Test System with High Voltage Silicon Carbide Technology
- Groundbreaking Ceremony for the Expansion of the Crystal Pulling Hall at Siltronic’s Freiberg Site
- A College of Semiconductor Research is Established at NTHU
- Semicon Taiwan 2021 is a Journey
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- Lower Your Total Cost of Ownership with High Performance Si3N4 AMB Substrates
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- First Aerospace-qualified Baseless Power Module Family Improves Aircraft Electrical System Efficiency
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- Geely and ROHM Concluded a Strategic Partnership on SiC Power Devices
- Space Industry Launches with GaN Systems
- Transphorm Closes JV Transaction for Acquisition of AFSW Wafer-Fab
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- STMicroelectronics Manufactures First 200mm Silicon Carbide Wafers
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- ROHM’s New Hybrid IGBTs with Built-In SiC Diode
- Mersen to Form Part of a SiC Semiconductor Supply Chain Network
- Heraeus Electronics Joins PowerAmerica Institute
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- SEMICON Southeast Asia 2021 Goes Virtual
- Infineon Silicon Carbide Virtual Event 2021
- Shanghai Tianyue Silicon Carbide Semiconductor Material Project is Published and is Expected to Start in Late July
- Japan’s Rohm Kicks off $45m Venture Fund to Drive New Chip Tech
- Huawei Obtains China Patent for Si IGBT
- Infineon Webinar: Power Semiconductor Solutions for the Development of Green Hydrogen Systems
- Power Integrations
- STMicroelectronics
- Infineon Technologies
- Mitsubishi Electric
- Danfoss Silicon Power
- Semikron
- SanRex
- GeneSiC
- On Semiconductor
- ShinDengen
- Alpha and Omega Semiconductor
- and many more …
- Semiconductor Wafer Producer SK Siltron CSS to Invest $300M in US to Boost EV Supply Chain
- 25 Years of Silicon Carbide at ST and the New Era Ahead
- Compound Semiconductor Quarterly Market Monitor
- Semikron Webinar: Thermal Resistance of Power Modules
- Flow S3 with Advanced Die-Attach Technology
- Zhixin Semiconductor Co., Ltd. IGBT Module Packaging and Testing Production Line was Officially Put into Operation
- ITEC Emerges as Independent Semiconductor Equipment Manufacturer
- ASM Expands Its Epitaxy Product Offerings with New Intrepid® ESA™
- ST and Exagan, The New Chapter in the Gallium Nitride Story
- TRENCHSTOP™ 5 WR6 Family in TO-247-3-HCC Housing
- After BYD, Another Chinese Company to Mass Produce Automotive IGBTs
- UK’s Largest Chip Plant to Be Acquired by Chinese-Owned Firm Nexperia
- Hitachi ABB Power Grids is Evolving to Become Hitachi Energy
- ON Semiconductor Celebrates Being Recognized as Most Sustainable Company in the Semiconductor Industry in 2021 by World Finance
- PCIM Asia Conference 2021 to Feature Over 50 Papers in Upcoming Edition
- Renault Group and STMicroelectronics Enter Strategic Cooperation on Power Electronics
- II-VI Incorporated Introduces Heated Ion Implantation Foundry Services for 150 mm Silicon Carbide Wafers
- Toshiba’s New Device Structure Improves SiC MOSFET High Temperature Reliability and Reduces Power Loss
- BYD Semiconductor Bumps Prices by 5% as Global Chip Shortage Persists
- Nagoya Institute of Technology and NGK Establish “NGK Environment Innovation Laboratory”
- New Semiconductor Fabs to Spur Surge in Equipment Spending
- EE Awards Asia
- EBV Elektronik Announces Strategic Cooperation with Infineon to Deliver Cutting-Edge Silicon Carbide Technologies
- Infineon Cements Position as the World’s Number One Automotive Semiconductor Supplier
- Trends in Worldwide Semiconductor Production Capacity
- Research Collaboration in Manufacture and Performance of SiC Schottky Diodes
- Hitachi New Facility is Being Established in the United States in Order to Collaborate and Create New Solutions with Customers
- Cree and Gospower Deliver Silicon Carbide to Server Power Supply Market
- Mitsubishi Electric to Launch T-series 2.0kV IGBT Module for Industrial Use
- ON Semiconductor Announces New Full Silicon Carbide MOSFET Module Solutions for Charging Electric Vehicles at APEC 2021
- Alpha and Omega Semiconductor Announces New Director Nominees
- How to Read an IGBT Module Datasheet
- Bosch Opens Chip Factory of the Future in Dresden
- Toshiba’s Triple-Gate IGBT Power Semiconductors Cut Switching Power Losses by 40.5%
- 5th Generation 650V SiC Schottky MPS™ Diodes for Best-in-Class Efficiency
- G3R™ 750V SiC MOSFETs Offer Unparalleled Performance and Reliability
- Japan Puts All Chips on the Table to Lure Semiconductor Makers
- Welsh Chip Maker Newport Wafer Fab Fears Chinese Takeover by Stealth
- SEMI: Global 200MM Fab Capacity on Pace to Meet Surging Demand, Address Chip Shortage
- Samsung Chose Infineon for Its First MOSFET-Based Refrigerator Inverter Design
- The 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD) is Online
- Join Wolfspeed Silicon Carbide Power Experts for a Five-Week Seminar Series
- Mitsubishi Electric
- Semikron
- Infineon Technologies
- Fuji Electric
- Hitachi ABB Power Grids
- Dynex Semiconductor
- Littelfuse
- On Semiconductor
- Wolfspeed
- Sirectifier
- STMicroelectroics
- SanRex
- Nexperia
- ROHM Semiconductor
- Vishay
- WeEn Semiconductors
- TSMC to Increase Auto Chip Output by 60% in 2021
- STMicroelectronics Honored with Prestigious IEEE Milestone for Historical “Multiple Silicon Technologies on a Chip” Achievement
- ROHM’s ‘Environmental Vision 2050’
- Gartner Says Global Chip Shortage Expected to Persist Until Second Quarter of 2022
- Japan to Boost Spending to Promote Local Chip Production
- Bodo’s Expert Talk in June
- China’s BYD Plans to Spin Off and List Semiconductor Unit
- Toshiba’s New Technology for SiC Power Modules Improves Reliability and Reduces Size
- The New SEMIKUBE for 3-Level Designs
- South Korea Vows to Build World’s Largest Semiconductor Belt
- ROHM and Mouser Present New eBook on Power Solutions for Next-Generation Electric Vehicles
- 15th International Seminar on Power Semiconductors
- Industry’s First Automotive Qualified SiC Six-Pack Power Module for EV Traction Inverters – Easy Power Upscaling with HybridPACK™ Drive CoolSiC™
- CISSOID Expands Its SiC Intelligent Power Modules Platform
- Imec and AIXTRON Demonstrate 200 mm GaN Epitaxy on AIX G5+ C for 1200V Applications with Breakdown in Excess of 1800V
- On Semi Brings Silicon Carbide to Formula E Power Inverter
- NXP Sells $2 Billion of Debt to Fund Power-Saving Semiconductors
- Infineon Increases Supply Security for Silicon Carbide by Expanding the Supplier Base
- Industry Alliance Crucial to SiC Advancement in Taiwan, Says Actron Chair
- SEMIKRON and Silicon Mobility Announce Collaboration into a 24V to 96V Inverter Platform for Batteries Powered Vehicles up to 50KW
- Mitsubishi Electric to Launch New X-Series HVIGBTs and HVDIODEs
- Nexperia’s 650 V GaN FETs Enable 80 PLUS ® Titanium-class Power Supplies Operating at 2 kW and Above
- EiceDRIVER™ X3 Enhanced and X3 Compact
- EasyPACK™ CoolSiC™ MOSFET Module Supports Fast-Switching DC-Link Voltage of 1500 V for Solar Systems and ESS Applications
- Yes Power Technix Supplies SiC Power Chips for Use in E-bikes
- JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Milestone Document for Bias Temperature Instability of Silicon Carbide (SiC) MOS Devices
- SiC MOSFET in Solar & Energy Storage Webinar
- TSMC Supplier Expects To Equip U.S. Chip Plant In September Next Year
- Yes Power Technix to Receive SiC Trench MOSFET Tech
- Foxconn in Talks to Buy Chip Plant to Support EV Ambitions
- Taiwan to Launch Programs to Expand Semiconductor Workforce
- Construction of Cree Site Nears Completion
- II-VI Incorporated Inaugurates Technology and R&D Center in Shanghai
- Benefits of Using Silicon Carbide in Next Generation Programmable Power Test Solutions
- II-VI Incorporated Expands Silicon Carbide Manufacturing Footprint for Power Electronics in Electric Vehicles and Clean Energy Applications
- New LoPak module: Now for 1200 V Applications with Same Familiar Packaging
- IIT Hyderabad, NXP India, MeitY Join Hands to Boost Semiconductor and IP Startups
- TSMC Plant Hit By Power Outage – Millions Of Dollars In Damage Expected
- Bidirectional Topologies and Semiconductors for e-Mobility On-Board Chargers
- Vishay Intertechnology World’s Best Automotive -80 V P-Channel MOSFET Increases Efficiency and Power Density
- China’s Wingtech Builds $2Bn EV-Geared Plant Amid Chip Shortage
- Boost for Semiconductor Production in Austria
- ROHM Semiconductor Europe Appoints New President
- Toshiba Gets Buyout Offer from British Private Equity Firm
- Push the Limits of Efficiency and Power Density for EV Charger Converters
- EBV Elektronik Presents: SiC/GaN Training Days
- APEC 2021 Conference Goes Virtual
- Renesas Says Normal Production at Fire-Hit Chip Plant to Take 100-120 Days
- CEO of Largest U.S. Chip Foundry Explains Why Semiconductor Shortage Could Last Through 2022
- How Will Chipmaker TSMC Spend $100 Billion in 3 Years? Easy
- China Cuts Taxes to Spur Semiconductor Expansion
- II-VI Wins Battle for Coherent
- High Efficient PFC Systems with STMicroelectronics Technology
- Achieving Industry-Leading Low Loss, Expanding the Discrete IGBT XS Series Lineup
- MiniSKiiP®DUAL with Advanced NEW Die-attach Technology
- Vitesco Technologies Wins Major Order for 800-volt Sic-Technology in Electric Vehicles
- South Korea Eyes Next-Generation Power Chips
- Semiconductor Equipment Billings Set Another Record High
- Show Must Go On. Live Semiconductor Events in April
- ZF Offers 800-Volt Components for Electric Vehicles
- Power-efficient On-board Electrical System Uses Technology Developed by Siemens Mobility and Infineon
- UnitedSiC FET-Jet Calculator
- Nexperia and United Automotive Electronic Systems Agree Comprehensive Partnership for Gallium Nitride
- China’s SMIC Gets Shenzhen Funds for US$2.4bn Fab
- Japan’s Silicon Wafer Latecomers Turn to China for Expansion
- Enabling 99.3% Efficiency in 3.6kW Totem-pole PFC Using 750V Gen 4 SiC FETs
- New 650 V CoolSiC™ Hybrid Discrete for Automotive
- Alpha and Omega Semiconductor Releases Automotive Qualified 1200V αSiC MOSFETs for Electric Vehicle Applications
- Renesas to Purchase Dialog Semiconductors for $5.9bn
- Power Electronics for E-Mobility 2021
- EE Times Presents: Roadmap to Next-Gen EV & AV
- EDA Direct and Siemens ‘Thermal Testing of High Power Density Semiconductors for Vehicle Electrification’ Webinar
- Bosch Reaches Milestone on the Way to Opening New Wafer Fab in Dresden
- Toshiba Electronic Devices & Storage Corporation Announces Major Investment in Power Devices Business
- Toshiba Releases 650V Super Junction Power MOSFETs
- Infineon Launched StrongIRFET™ 2 Power MOSFETs
- Marelli Launches Proprietary Full SiC Power Module for Electric and Hybrid Traction Applications in Motorsports
- The 2021 Technology Outlook for Silicon Carbide Semiconductors
- Bodo’s WBG Expert Talk
- Toshiba Launches Silicon Carbide MOSFET Module
- Nexperia Announces Plans to Grow Global Production and Increase R&D Spend
- ON Semiconductor CEO Expects Auto Chip Backlog to End by Third Quarter
- Denso Expands Semiconductor Capacity in Malaysia
- Infineon Says Can Meet Chip Demand with Help of New Austria Plant
- Biden to Order EV Battery, Mineral Supply Chain Review
- Powerex Announces New CEO
- Power SiC – Life in The Fast Lane as SiC Penetration Accelerates – Webcast
- GeneSiC’s New 3rd Generation SiC MOSFETs
- ON Semiconductor’s New 650V Silicon Carbide MOSFETs
- NXP and Infineon Plants Hit by Power Outage in Texas Storm
- TSMC to Help Automotive Industry
- Chipmaker Renesas Halts Ibaraki Plant Operations on Quake Checks
- Industrial Wide-Bandgap Developer Forum
- GaN for Appliance and Industrial Applications
- PCIM Europe to Be Held Digitally Only from 3–7 May 2021
- GaN Systems Ships 20,000,000 GaN Transistors
- CEO Interview: The Next Generation of GaN Power ICs
- ROHM SiC MOSFETs Solve Design Challenges for Leading Solar Energy Company Midnite Solar
- Richardson Electronics, Ltd. Continues Expansion of Power Management Capabilities with SemiQ Third Generation SiC Diode Modules
- Infineon Bets on Strong EV Growth
- US Chip Industry Calls on Biden Administration to Fund Factories
- Review of the 2020 Semiconductor Market and a Look to 2021
- SemiSel 5: Simplify Power Semiconductor Selection
- Samsung considers purchasing NXP Semiconductors, Renesas, Infineon, or Texas Instruments
- Infineon Strives to Meet Auto Industry Demand as Supply Chains Creak
- Infineon New 650 V CoolSiC™ Hybrid IGBT
- Chip Shortage Disrupts General Motors to Idle Three North American Plants Next Week
- JEDEC Wide Bandgap Power Semiconductor Committee Publishes its First Guideline for Silicon Carbide (SiC) Based Power Conversion Devices
- PCIM Europe Will Take Place from 31 August – 2 September 2021 in Nuremberg, Germany
- Fuji Electric Launches X Series IGBT
- Vincotech’s New 1200 V Sixpack Solution for Servo Drive Applications
- ROHM Completes New Building at Apollo Plant in Chikugo
- Mouser Has Announced a Global Distribution Agreement with SanRex
- Da Nang Licenses US$110 Million Semiconductor Project
- Toshiba’s Lineup Expansion of Schottky Barrier Diodes
- AspenCore Guide to Gallium Nitride: A New Era for Power Electronics
- PCIM Asia relocates to Shenzhen in September 2021
- SK Group Invests in Domestic Producer of Silicon Carbide
- Vishay 650 V SiC Schottky Diodes
- Japan’s Renesas Steps in to Ease Automotive Chip Shortage
- Infineon Expands EiceDRIVER Portfolio
- JEDEC WBG Power Semiconductor Committee Publishes New Test Method
- Anglia Expands SiC Portfolio with UnitedSiC
- Power Semiconductors Webinars
- On Semiconductor and Cree Changes in Management
- Denso’s new silicon carbide power semiconductors used in Toyota Mirai
- Rohm will invest 60 billion yen to increase output of next-generation power semiconductors for
- Automotive Chip Shortages Only Part of the Problem
- Major China MOSFET supplier raises prices
- 3rd Generation 650V/1200V SiC Diode Modules Released from SemiQ
- Cree Delivers New Silicon Carbide Power Module Portfolio
- The Infineon-Cypress Merger: What Does it Mean for the Tech Industry?